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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
FEATURES
* SPECIAL FOR HIGH CURRENT AND LOW FORWARD VOLTAGE * HIGH POWER * AVAILABLE FOR PULSE OPERATING * WIDE VIEWING ANGLE * WATER CLEAR PACKAGE * SOLDER PLATED LEADS
PACKAGE DIMENSIONS
NOTES: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.5mm(.059") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. 6. The vender of dice is OTC. Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4 Page : 1 of 5
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
ABSOLUTE MAXIMUM RATINGS AT TA=25
PARAMETER Power Dissipation Peak Forward Current (300pps, 10s pulse) Continuous Forward Current Reverse Voltage Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [4.0mm(.157") From Body] MAXIMUM RATING 150 2 100 5 -40 to + 85 -55 to + 100 320 for 3 Seconds UNIT mW A mA V
ELECTRICAL / OPTICAL CHARACTERISTICS AT TA=25
PARAMETER Aperture Radiant Incidence Radiant Intensity Radiant Intensity Peak Emission Wavelength Spectral Line Half-Width Forward Voltage Forward Voltage Forward Voltage Reverse Current Viewing Angle (See FIG.6) SYMBOL MIN. TYP. MAX. Ee IE IE P VF VF VF IR 21/2 20 50 0.80 30 6 10.5 940 50 1.25 1.65 2.0 1.6 2.1 2.4 100 1.4 UNIT mW/c mW/sr mW/sr nm nm V V V A deg. TEST CONDITION IF = 20mA IF = 100mA IF = 20mA IF = 20mA IF = 20mA IF = 50mA IF = 250mA IF = 450mA VR = 5V
Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
TYPICAL ELECTRICAL / OPTICAL CHARACTERISTICS CURVES
(25 Ambient Temperature Unless Otherwise Noted)
1.0
Relative Radiant Intensity Forward Current IF (mA)
120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100
0.5
0 840
940 Wavelength (nm)
1040
Ambient Temperature Ta ( o C)
FIG.1 SPECTRAL DISTRIBUTION
1000
Output Power Relative To Value at IF=20mA Forward Current (mA)
FIG.2 FORWARD CURRENT VS. AMBIENT TEMPERATURE
1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80
100
10
0
1.0
1.5
2.0
2.5
3.0
Forward Voltage (V)
Ambient Temperature Ta ( o C)
FIG.3 FORWARD CURRENT VS. FORWARD VOLTAGE
40 36 32 28 24 20 16 12 8 4 0
FIG.4 RELATIVE RADIANT INTENSITY VS. AMBIENT TEMPERATURE
0
Relative Radiant Intensity
o
10
o
20
o
30
o
Output Power Relative To Value at IF=20mA
40 1.0 0.9 0.8 0.7 50 60 70 80 90 0.5 0.3 0.1 0.2 0.4 0.6
o
o
o
o o o
0
200
400
600
800 1000
Foward Current (mA)
FIG.5 RELATIVE RADIANT INTENSITY VS. FORWARD CURRENT
FIG.6 RADIATION DIAGRAM
Part No. : LTE-3271T-A1 DATA SHEET BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
PACKING
LTE-3271T-A1
16
m 5m
130mm
LTE-3271T-A1
30 0m m
DIVICE NO.
BIN
QUANTITY
LTE-3271T-A1
295mm
Q.C STAMP
61
0m m 35 m 0m
Bag volume (pcs / Bag) 1000
Inner carton volume (Bag / carton) 8
Outer carton volume (Box / Carton) 8
Total volume (pcs/outer carton) 64000
Part No. : LTE-3271T-A1 DATA SHEET
BNS-OD-C131/A4
Page :
4
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5
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon's Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices).
2. Storage The storage ambient for the LEDs should not exceed 30C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 320C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100C Max. 60 sec. Max. 260C Max. 5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED
Part No. : LTE-3271T-A1 DATA SHEET
BNS-OD-C131/A4
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